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TCD1304AP - Toshiba

Description: CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device)

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TCD1304AP - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - TCD1304AP
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TCD1304AP - Toshiba  - 3D model - Dual-In-Line Packages - TCD1304AP
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TCD1304AP Details

  • Manufacturer Part Number:

    TCD1304AP

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-22

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    4.9

  • Additional Feature:

    ELECTRONIC SHUTTER

  • Array Type:

    LINEAR

  • Body Breadth:

    10.16 mm

  • Body Height:

    3.22 mm

  • Body Length or Diameter:

    41.6 mm

  • Dynamic Range:

    50 dB

  • Horizontal Pixel:

    3648

  • Housing:

    CERAMIC, GLASS-SEALED

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Operating Temperature-Max:

    60 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Range:

    1.50-3.50V

  • Output Type:

    ANALOG VOLTAGE

  • Package Shape/Style:

    RECTANGULAR

  • Pixel Size:

    8X200 µm

  • Sensitivity (V/lx.s):

    160 V/lx.s

  • Sensors/Transducers Type:

    IMAGE SENSOR,CCD

  • Spectral Response (nm):

    400-1100

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Surface Mount:

    NO

  • Termination Type:

    SOLDER

  • Vertical Pixel:

    1

TCD1304AP Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the TCD1304AP is -20°C to 70°C, although it can operate up to 85°C with reduced performance.
  • To prevent damage, handle the TCD1304AP by the edges, avoid touching the pins, and use an anti-static wrist strap or mat during PCB assembly.
  • The maximum clock frequency that the TCD1304AP can support is 20 MHz, although it can operate at lower frequencies with reduced power consumption.
  • To optimize ADC performance, ensure proper power supply decoupling, use a low-noise analog power supply, and minimize digital noise coupling to the analog circuitry.
  • While the TCD1304AP is not specifically designed for high-humidity environments, it can operate in humid conditions with proper packaging and sealing to prevent moisture ingress.

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