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TCK108AG,LF - Toshiba

Description: Power Switch ICs - Power Distribution Load Switch IC

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PCB Footprints
TCK108AG,LF - Toshiba PCB footprint - BGA - BGA - WCSP4D
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3D Models
TCK108AG,LF - Toshiba  - 3D model - BGA - WCSP4D
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TCK108AG,LF Details

  • Manufacturer Part Number:

    TCK108AG,LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WCSP-4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-XBGA-B4

  • Length:

    0.79 mm

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.59 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.1 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    0.79 mm

TCK108AG,LF Frequently Asked Questions (FAQs)

  • The recommended storage temperature for TCK108AG,LF is -40°C to 125°C.
  • Yes, TCK108AG,LF is RoHS (Restriction of Hazardous Substances) compliant, meaning it does not contain hazardous substances like lead, mercury, and cadmium.
  • The maximum operating temperature range for TCK108AG,LF is -40°C to 85°C.
  • Yes, TCK108AG,LF is AEC-Q101 qualified, making it suitable for use in automotive applications.
  • The typical power dissipation for TCK108AG,LF is 1.5W.

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TCK108AG,LF Overview

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