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TCK208G - Toshiba

Description:  Low input voltage operation: VIN = 0.75 to 3.6 V  High output current: IOUT (DC) = 2.0 A  Low ON resistance : RON = 18.1 mΩ (typ.) at VIN = 3.3 V, -1.5 A RON = 18.2 mΩ (typ.) at VIN = 1.2 V, -1.5 A RON = 18.4 mΩ (typ.) at VIN = 0.75 V, -1.5 A  Built in Slew rate control driver  Built in Reverse current blocking(SW OFF state)  Built in Auto-discharge (TCK207G and TCK208G)

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PCB Footprints
TCK208G - Toshiba PCB footprint - BGA - BGA - WCSP4C
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3D Models
TCK208G - Toshiba  - 3D model - BGA - WCSP4C
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TCK208G Details

  • Manufacturer Part Number:

    TCK208G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:2A

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-XBGA-B4

  • Length:

    0.9 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.539 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.75 V

  • Supply Voltage-Nom (Vsup):

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    0.9 mm

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This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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TCK208G Overview

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