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TCM809JVLB713 - Microchip

Description: Voltage supervisor,4.00V,PP,Low,SC70 Microchip TCM809JVLB713, Voltage Supervisor 3.89 ??? 4.1 V, 3-Pin SC-70

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PCB Footprints
TCM809JVLB713 - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3-lead-LB-SC70
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TCM809JVLB713 - Microchip  - 3D model - SOT23 (3-Pin) - 3-lead-LB-SC70
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TCM809JVLB713 Details

  • Manufacturer Part Number:

    TCM809JVLB713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LEAD FREE, PLASTIC, SC-70, 3-PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SC70-3

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.03 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.25 mm

TCM809JVLB713 Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad layout with a minimum of 2 oz copper thickness, and a thermal via array with a minimum of 10 vias under the package to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating curves. Additionally, ensure that the device is operated within its specified temperature range and that adequate cooling mechanisms are in place.
  • The input capacitor should be a low-ESR ceramic capacitor with a minimum value of 10 μF, and the output capacitor should be a low-ESR ceramic capacitor with a minimum value of 22 μF. The capacitors should be placed as close as possible to the device's input and output pins.
  • To troubleshoot issues with the PGOOD signal, check the device's output voltage, input voltage, and enable pin (EN) to ensure they are within the specified ranges. Also, verify that the PGOOD pin is properly connected to the system's power management circuitry.
  • Not using the internal soft-start feature may result in higher inrush currents during startup, which can lead to voltage drops, electromagnetic interference (EMI), and increased stress on the device and surrounding components. It's recommended to use the internal soft-start feature to ensure a controlled startup sequence.

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TCM809JVLB713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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