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TCM809LENB713 - Microchip

Description: Supervisory 4.63V Active Low SOT23B

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PCB Footprints
TCM809LENB713 - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TCM809LENB713-1
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3D Models
TCM809LENB713 - Microchip  - 3D model - SOT23 (3-Pin) - TCM809LENB713-1
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TCM809LENB713 Details

  • Manufacturer Part Number:

    TCM809LENB713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, TO-236, SOT-23B, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.03 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.63V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

TCM809LENB713 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust power-on reset circuit, ensure a stable clock source, and consider using a temperature sensor to monitor the device's temperature.
  • Use a combination of ceramic and electrolytic capacitors, with a minimum of 10uF capacitance per power pin. Place decoupling capacitors as close to the device as possible.
  • Use a high-quality clock source, ensure a balanced clock tree, and consider using a clock conditioner or jitter attenuator. Minimize clock signal routing and use a clock distribution network.
  • Use the internal oscillator calibration feature to optimize frequency accuracy. Set the oscillator to the desired frequency, and ensure the clock source is stable and reliable.

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TCM809LENB713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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