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TCM809RVLB713 - Microchip

Description: MCU Reset Monitor 2.63V Act.Low SC-70

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TCM809RVLB713 - Microchip - PCB symbol
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PCB Footprints
TCM809RVLB713 - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MIC1555YD5-TR
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TCM809RVLB713 - Microchip - 3D model - SOT23 (3-Pin) - MIC1555YD5-TR
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TCM809RVLB713 Details

  • Manufacturer Part Number:

    TCM809RVLB713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LEAD FREE, PLASTIC, SC-70, 3-PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SC70-3

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.025 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.63V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.25 mm

TCM809RVLB713 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Not using the recommended bypass capacitors can lead to instability, noise, and reduced performance. The bypass capacitors help to filter out noise and ensure stable operation, so it is recommended to use them as specified in the datasheet.
  • Check the clock output frequency and amplitude using an oscilloscope. Ensure that the clock input is within the recommended frequency range and that the clock output is not loaded excessively. Also, verify that the device is properly configured and that the clock output is not affected by noise or interference.
  • In high-reliability applications, consider using a redundant design, implementing error detection and correction mechanisms, and ensuring that the device is operated within its recommended specifications. Also, perform thorough testing and validation to ensure the device meets the required reliability standards.

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TCM809RVLB713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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