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TCM809SVNB713 - Microchip

Description: MCU Reset Monitor 2.93V Act.Low SOT23

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PCB Footprints
TCM809SVNB713 - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TCM809SVNB713
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3D Models
TCM809SVNB713 - Microchip  - 3D model - SOT23 (3-Pin) - TCM809SVNB713
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TCM809SVNB713 Details

  • Manufacturer Part Number:

    TCM809SVNB713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    LEAD FREE, PLASTIC, TO-236, SOT-23B, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.025 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Width:

    1.3 mm

TCM809SVNB713 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • To ensure reliable operation, follow the recommended operating conditions, and consider the thermal derating curves provided in the datasheet. Also, ensure that the device is properly soldered and the PCB is designed to minimize thermal resistance.
  • Use a metal shield or a conductive enclosure to minimize EMI and RFI emissions. Ensure that the PCB layout is designed to minimize radiation, and consider using EMI filters or chokes if necessary.
  • Follow the recommended power sequencing guidelines in the datasheet to ensure proper device operation. Ensure that the power supplies are sequenced correctly, and the device is powered up and down correctly to prevent damage.
  • Use the recommended programming tools and software provided by Microchip Technology Inc. Follow the programming guidelines and ensure that the device is configured correctly to prevent errors or damage.

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TCM809SVNB713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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