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TCM811TERCTR - Microchip

Description: Supervisory 3.08V Active Low SOT143

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Symbol
TCM811TERCTR - Microchip - PCB symbol
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PCB Footprints
TCM811TERCTR - Microchip PCB footprint - Other - Other - SOT 143
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3D Models
TCM811TERCTR - Microchip - 3D model - Other - SOT 143
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TCM811TERCTR Details

  • Manufacturer Part Number:

    TCM811TERCTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-143

  • Package Description:

    SOT-143, 4 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TO-253

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.22 mm

  • Supply Current-Max (Isup):

    0.01 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.92 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.08V

  • Width:

    1.3 mm

TCM811TERCTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current specifications. Use a reliable power supply, and consider adding decoupling capacitors to minimize voltage drops. Also, ensure that the device is properly soldered and that the PCB is free from defects.
  • Use a metal shield or a shielded enclosure to minimize EMI and RFI emissions. Ensure that the PCB is designed with EMI and RFI considerations in mind, such as using a solid ground plane, minimizing trace lengths, and using EMI filters if necessary.
  • The POR and BOR features are enabled by default. Ensure that the power supply is stable and within the recommended voltage range. Use an external reset circuit if necessary, and consider adding a capacitor to the reset pin to filter out noise.
  • Use a high-quality clock source, and ensure that the clock signal is properly terminated. Minimize clock signal routing, and use a clock buffer if necessary. Also, ensure that the clock frequency is within the recommended range.

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TCM811TERCTR Overview

Use the download button to access the TCM811TERCTR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TCM81, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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