TCMD4000 footprint, schematic symbol and 3D model by Vishay

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PCB Footprints

TCMD4000 Details

A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures.
The maximum allowable voltage stress is 1.5 times the rated voltage (400V) for a maximum of 100 ms. Exceeding this may cause device damage or failure.
Use a transient voltage suppressor (TVS) or a metal oxide varistor (MOV) in parallel with the device to absorb voltage spikes and surges.
Store the devices in a dry, cool place with a relative humidity below 60%. Avoid exposing the devices to moisture, high temperatures, or direct sunlight.

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Use the download button to access the TCMD4000 schematic symbol and PCB footprint.

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