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TCP1C105M8R - ROHM Semiconductor

Description: Tantalum Capacitors - Solid SMD 0805 16V 10uF 20% Tantalum Cap-std

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Symbol
TCP1C105M8R - ROHM Semiconductor - PCB symbol
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PCB Footprints
TCP1C105M8R - ROHM Semiconductor PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - TCP1C105M8R
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3D Models
TCP1C105M8R - ROHM Semiconductor - 3D model - Capacitor Moulded Polarised - TCP1C105M8R
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TCP1C105M8R Details

  • Manufacturer Part Number:

    TCP1C105M8R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • Capacitance:

    1 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • Height:

    1.2 mm

  • JESD-609 Code:

    e1

  • Leakage Current:

    0.0005 mA

  • Length:

    2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, 7 Inch

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    16 V

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Tan Delta:

    0.1

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Shape:

    J BEND

  • Width:

    1.25 mm

TCP1C105M8R Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TCP1C105M8R is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm. The land pattern should be designed to accommodate the device's lead-free terminations.
  • To handle the TCP1C105M8R's power dissipation, ensure that the device is mounted on a PCB with a sufficient thermal conductivity. A thermal via or a heat sink can be used to improve heat dissipation. Additionally, ensure that the device is operated within its recommended operating temperature range of -40°C to 105°C.
  • The recommended soldering temperature profile for the TCP1C105M8R is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To ensure the TCP1C105M8R's reliability in high-humidity environments, apply a conformal coating to the device and the PCB. Additionally, ensure that the device is stored in a dry environment, and that the PCB is designed with moisture-resistant materials.
  • The TCP1C105M8R has an ESD rating of 2kV human body model (HBM) and 200V machine model (MM). Handling precautions should be taken to prevent ESD damage during assembly and testing.

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TCP1C105M8R Overview

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