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TCR3UG18A,LF - Toshiba

Description: LDO Voltage RegulatoUltra low quiescent current, Fast Load Transient 300 mA CMOS Low Drop-Out Regulator in ultra small packagers LDO Linear Voltage Regulator .3A 1.8V

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Symbol
TCR3UG18A,LF - Toshiba - PCB symbol
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PCB Footprints
TCR3UG18A,LF - Toshiba PCB footprint - BGA - BGA - TCR3UG33B,LF
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3D Models
TCR3UG18A,LF - Toshiba - 3D model - BGA - TCR3UG33B,LF
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TCR3UG18A,LF Details

  • Manufacturer Part Number:

    TCR3UG18A,LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WCSP-4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.457 V

  • Dropout Voltage1-Nom:

    0.335 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.8 V

  • JESD-30 Code:

    S-XBGA-B4

  • Length:

    0.645 mm

  • Line Regulation-Max:

    0.015%

  • Load Regulation-Max:

    0.03%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.818 V

  • Output Voltage1-Min:

    1.782 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Voltage Tolerance-Max:

    1%

  • Width:

    0.645 mm

TCR3UG18A,LF Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer of the PCB, connected to the thermal pad of the TCR3UG18A,LF. This helps to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device.
  • Handle the device by the body, not the leads, to prevent damage. Avoid touching the leads or any other exposed metal parts to prevent electrostatic discharge (ESD) damage.
  • Yes, the TCR3UG18A,LF is suitable for high-reliability applications. It is designed and manufactured to meet the requirements of automotive and industrial applications, and is qualified to AEC-Q100 and IEC 60747 standards.
  • The suitable input capacitor value depends on the input voltage, output voltage, and output current requirements of your application. A general guideline is to use a capacitor with a value of 10uF to 22uF, with a voltage rating of 25V or higher.

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TCR3UG18A,LF Overview

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