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TD190N16SOFHPSA2 - Infineon

Description: Discrete Semiconductor Modules LÖT-BOND MODULE

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TD190N16SOFHPSA2 - Infineon  - 3D model
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TD190N16SOFHPSA2 Details

  • Manufacturer Part Number:

    TD190N16SOFHPSA2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODULE-5

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DC Gate Trigger Current-Max:

    145 mA

  • JESD-30 Code:

    R-XUFM-X5

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RMS On-state Current-Max:

    275 A

  • Reference Standard:

    IEC-747-6; UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    1600 V

  • Repetitive Peak Reverse Voltage:

    1600 V

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Trigger Device Type:

    SCR

TD190N16SOFHPSA2 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the TD190N16SOFHPSA2 is -55°C to 175°C, as specified in the datasheet. However, it's recommended to operate within the recommended operating temperature range of -40°C to 150°C for optimal performance and reliability.
  • To ensure proper biasing, make sure to provide a sufficient gate-source voltage (Vgs) to turn the MOSFET on. The recommended Vgs is typically around 10-15V, but it's essential to check the datasheet for the specific device. Additionally, ensure the gate-source resistance (Rgs) is within the recommended range to prevent oscillations and ensure stable operation.
  • The maximum current rating for the TD190N16SOFHPSA2 is 190A, as specified in the datasheet. However, it's essential to consider the maximum current rating in conjunction with the maximum junction temperature (Tj) and the thermal resistance (Rth) to ensure the device operates within its safe operating area (SOA).
  • Proper thermal management is crucial for the TD190N16SOFHPSA2. Ensure the device is mounted on a suitable heat sink with a low thermal resistance. The heat sink should be designed to dissipate the maximum power dissipation (Pd) specified in the datasheet. Additionally, consider using thermal interface materials (TIMs) to reduce the thermal resistance between the device and the heat sink.
  • For optimal performance and reliability, follow these PCB layout considerations: keep the gate-source and gate-drain traces as short as possible, use a solid ground plane, and ensure the drain-source current path is as short and wide as possible. Additionally, consider using a Kelvin connection for the gate-source voltage to reduce noise and oscillations.

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TD190N16SOFHPSA2 Overview

Use the download button to access the TD190N16SOFHPSA2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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