- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for TD62064APG
- Part Number TD62064APG
- Manufacturer Toshiba
- Pin Count 16
- Part Category Integrated Circuit
- Package Category Dual-In-Line Packages
- Footprint Name Dual-In-Line Packages - DIP16-P-300-2.54A_
- Released Date Jun 14, 2021
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
TD62064APG Details
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Manufacturer Part Number:
TD62064APG
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Part Package Code:
DIP
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Package Description:
LEAD FREE, PLASTIC, DIP-16
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Pin Count:
16
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.60
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Manufacturer:
Toshiba America Electronic Components
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YTEOL:
0
TD62064APG Frequently Asked Questions (FAQs)
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Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, use a heat sink if necessary, and consider derating the device's power consumption according to the temperature derating curve provided in the datasheet.
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Although the datasheet specifies the recommended operating voltage range, it's essential to note that the maximum allowable voltage on the input pins is typically 5.5V, and exceeding this voltage may cause damage to the device.
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To prevent ESD damage, it's crucial to follow proper ESD handling and assembly procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Additionally, consider implementing ESD protection devices, such as TVS diodes, in the circuit design.
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Toshiba recommends soldering the TD62064APG using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30 seconds. Hand soldering is not recommended due to the device's small size and lead pitch.
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TD62064APG Overview
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