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TDA1517ATW/N1,112 - NXP

Description: Audio Amplifiers 8W BTL.M. MEDIA AMP 20 leads SOT527-1

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TDA1517ATW/N1,112 - NXP - PCB symbol
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PCB Footprints
TDA1517ATW/N1,112 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT527-1
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3D Models
TDA1517ATW/N1,112 - NXP - 3D model - Small Outline Packages - SOT527-1
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TDA1517ATW/N1,112 Details

  • Manufacturer Part Number:

    TDA1517ATW/N1,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP2

  • Package Description:

    PLASTIC, HTSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOT527-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    20 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    4 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    80 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

TDA1517ATW/N1,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the TDA1517ATW/N1,112 near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
  • To ensure EMC with the TDA1517ATW/N1,112, follow proper PCB design guidelines, such as keeping the device away from noise sources, using a solid ground plane, and implementing proper shielding and filtering techniques. Additionally, ensure that the device is properly decoupled and that the power supply is well-regulated.
  • Recommended test and measurement procedures for the TDA1517ATW/N1,112 include using a high-impedance probe to measure voltage and current, and using a spectrum analyzer to measure frequency response and distortion. It is also important to follow proper safety procedures when working with high-voltage and high-current circuits.
  • To troubleshoot common issues with the TDA1517ATW/N1,112, start by checking the power supply voltage and current, and ensuring that the device is properly cooled. Check for signs of overheating, such as excessive temperature or thermal shutdown. For distortion issues, check the input signal quality and ensure that the device is properly biased.
  • Recommended storage and handling procedures for the TDA1517ATW/N1,112 include storing the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or leads, and use anti-static precautions to prevent damage from electrostatic discharge.

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TDA1517ATW/N1,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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