A good thermal design should be used to ensure optimal heat dissipation. A minimum of 2oz copper thickness is recommended, and thermal vias should be placed under the device to dissipate heat efficiently.
To ensure EMC, use a shielded cable for the output stage, and keep the device away from high-frequency sources. Additionally, use a common-mode choke and a ferrite bead to filter out high-frequency noise.
The maximum allowed voltage on the bootstrap capacitor is 35V. Exceeding this voltage may damage the device.
Use a voltage supervisor or a voltage monitor to detect overvoltage and undervoltage conditions. The device can also be protected using external components such as TVS diodes or zener diodes.
A ceramic capacitor with a value of 1uF to 10uF is recommended for the input stage. The capacitor should be placed as close as possible to the device's input pins.
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TDA21520AUMA1 Overview
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