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TDA7376B - STMicroelectronics

Description: STMICROELECTRONICS - TDA7376B - AMPLIFIER, CLASS AB, 80W, MULTIWATT-15

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TDA7376B - STMicroelectronics - PCB symbol
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PCB Footprints
TDA7376B - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - Multiwatt15 V
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TDA7376B - STMicroelectronics - 3D model - Transistor Outline, Vertical - Multiwatt15 V
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TDA7376B Details

  • Manufacturer Part Number:

    TDA7376B

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ZFM

  • Package Description:

    ROHS COMPLIANT, MULTIWATT-15

  • Pin Count:

    15

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Gain:

    26 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PZIP-T15

  • JESD-609 Code:

    e3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Output Power-Nom:

    37 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    ZIP

  • Package Equivalence Code:

    ZIP15,.2,.17TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    200 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    ZIG-ZAG

TDA7376B Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA7376B involves keeping the power supply lines as short as possible, using a solid ground plane, and placing the input and output capacitors close to the IC. Additionally, it's recommended to use a shielded enclosure and to keep the audio signals away from the power supply lines.
  • To optimize the gain structure of the TDA7376B, you need to consider the input signal level, the desired output power, and the impedance of the load. A good starting point is to set the gain to 20 dB and then adjust it based on the specific requirements of your application. You can also use the datasheet's application circuit as a reference.
  • The TDA7376B has a maximum junction temperature of 150°C. To ensure reliable operation, you should ensure good heat dissipation by using a heat sink, keeping the device away from heat sources, and avoiding high ambient temperatures. You should also follow the recommended PCB layout and thermal management guidelines.
  • To protect the TDA7376B from overvoltage and overcurrent conditions, you can use voltage regulators, zener diodes, and current-limiting resistors. You should also ensure that the power supply voltage is within the recommended range of 9-18V. Additionally, you can use a fuse or a polyfuse to protect against overcurrent conditions.
  • The TDA7376B has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. You should also ensure that the PCB is designed with ESD protection in mind, using components such as TVS diodes and ESD-protection devices.

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TDA7376B Overview

Use the download button to access the TDA7376B schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA73, or try a keyword search, such as Audio/Video Amplifiers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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