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TDA7391LV - STMicroelectronics

Description: STMicroelectronics TDA7391LV Audio Amplifier IC, Class-AB 65dB, 11-Pin MULTIWATT

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TDA7391LV - STMicroelectronics - PCB symbol
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PCB Footprints
TDA7391LV - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - Multiwatt11 V
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TDA7391LV - STMicroelectronics - 3D model - Transistor Outline, Vertical - Multiwatt11 V
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TDA7391LV Details

  • Manufacturer Part Number:

    TDA7391LV

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MULTIWATT-11

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Gain:

    30 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-XZIP-T11

  • JESD-609 Code:

    e3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    11

  • Output Power-Nom:

    32 W

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZIP

  • Package Equivalence Code:

    ZIP11,.2,.17,67TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.7 mm

  • Terminal Position:

    ZIG-ZAG

TDA7391LV Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA7391LV involves keeping the analog and digital grounds separate, using a star-ground configuration, and placing the device close to the power supply. Additionally, using a 4-layer PCB with a dedicated ground plane can help reduce EMI.
  • The TDA7391LV requires a single 5V power supply. It's essential to ensure that the power supply is stable and well-regulated. The power sequencing requirement is to power up the device after the power supply has reached its nominal value. A soft-start circuit can be used to reduce inrush current during power-up.
  • The TDA7391LV has a thermal pad that must be connected to a thermal ground plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink. Additionally, ensuring good airflow around the device and using a heat sink with a thermal conductivity of at least 1 W/m-K can help keep the device within its recommended operating temperature range.
  • To troubleshoot issues with the TDA7391LV, start by verifying the power supply and ensuring it's stable and well-regulated. Check the PCB layout for any potential issues, such as poor grounding or inadequate decoupling. Use an oscilloscope to measure the output voltage and current, and check for any signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • To ensure EMC compliance, use a shielded enclosure, and ensure the PCB is designed with EMC in mind. Use a common-mode choke to filter the input power, and add decoupling capacitors to reduce electromagnetic radiation. Additionally, use a ferrite bead or a common-mode filter on the output to reduce electromagnetic interference (EMI).

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TDA7391LV Overview

Use the download button to access the TDA7391LV schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA73, or try a keyword search, such as Audio/Video Amplifiers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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