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TDA7491P13TR - STMicroelectronics

Description: 2 x 10-watt dual BTL class-D audio amplifier

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TDA7491P13TR - STMicroelectronics - PCB symbol
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TDA7491P13TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO36_1
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TDA7491P13TR - STMicroelectronics - 3D model - Small Outline Packages - PowerSSO36_1
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TDA7491P13TR Details

  • Manufacturer Part Number:

    TDA7491P13TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, SSOP-36

  • Pin Count:

    36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    32 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    70 °C

  • Output Power-Nom:

    10 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.47 mm

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

TDA7491P13TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA7491P13TR should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat. Avoid routing critical signals under the device, and keep the PCB layer stack-up symmetrical to minimize thermal gradients.
  • For optimal output filter design, use a 2nd-order LC filter with a cutoff frequency around 150 kHz to 200 kHz. Choose inductors with low DCR and high Q-factor, and capacitors with low ESR. Ensure the filter components are placed close to the device to minimize parasitic inductance and capacitance.
  • When selecting the bootstrap capacitor (CBOOT) value, consider the device's operating frequency, output power, and voltage supply. A larger CBOOT value (e.g., 10nF to 22nF) is recommended for higher output power and frequency applications, while a smaller value (e.g., 1nF to 4.7nF) is suitable for lower power and frequency applications.
  • To ensure the TDA7491P13TR operates within its safe operating area (SOA), monitor the device's junction temperature (TJ) and ensure it stays below the maximum rated value (150°C). Also, keep the output power and voltage within the recommended specifications, and avoid operating the device in a high-temperature environment.
  • For optimal decoupling, use a combination of ceramic capacitors with values ranging from 100nF to 10uF, placed close to the device's power pins. Place a 100nF capacitor near the VIN pin, and a 1uF to 10uF capacitor near the VCC pin. Ensure the capacitors are connected to a low-impedance ground plane to minimize noise and oscillations.

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TDA7491P13TR Overview

Use the download button to access the TDA7491P13TR schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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