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TDA749213TR - STMicroelectronics

Description: 50 W + 50 W dual BTL class-D audio amplifier

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TDA749213TR - STMicroelectronics - PCB symbol
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TDA749213TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO-36 EPU_2022
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TDA749213TR - STMicroelectronics - 3D model - Small Outline Packages - PowerSSO-36 EPU_2022
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TDA749213TR Details

  • Manufacturer Part Number:

    TDA749213TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, SSOP-36

  • Pin Count:

    36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    70 °C

  • Output Power-Nom:

    50 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP36,.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.45 mm

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TDA749213TR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends using a 10uF ceramic capacitor and a 100nF ceramic capacitor in parallel, placed as close as possible to the power supply pins (VP and VN) to ensure stable operation.
  • To minimize electromagnetic interference (EMI) and ensure optimal performance, it is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane. Additionally, place the amplifier IC close to the speaker connectors and use short, direct traces for the audio signals.
  • The maximum power dissipation of the TDA749213TR is 30W, assuming a junction temperature (TJ) of 150°C. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB and heat sink.
  • Yes, the TDA749213TR can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply, speaker impedance, and thermal management to avoid overheating and ensure reliable operation.
  • To protect the TDA749213TR from overvoltage and undervoltage conditions, it is recommended to use a voltage regulator or a voltage supervisor IC to monitor the power supply voltage and reset the amplifier IC if it falls outside the recommended operating range.

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TDA749213TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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