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TDA75613LV - STMicroelectronics

Description: Low voltage operation, high efficiency (class SB), intelligent, quad BTL output power amplifier with speaker safety routine (SSR), full I2C diagnostics including tweeter detection and hardware stand-by/mute

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TDA75613LV - STMicroelectronics - PCB symbol
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PCB Footprints
TDA75613LV - STMicroelectronics PCB footprint - Other - Other - FLEXIWATT FM2 27_H=19.37
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3D Models
TDA75613LV - STMicroelectronics - 3D model - Other - FLEXIWATT FM2 27_H=19.37
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TDA75613LV Details

  • Manufacturer Part Number:

    TDA75613LV

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FLEXIWATT-27

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.02%

  • JESD-30 Code:

    R-XZFM-T27

  • Length:

    29.23 mm

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    27

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    64 W

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZFM

  • Package Equivalence Code:

    ZIP27,.16,.16,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Seated Height-Max:

    19.37 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    NO

  • Technology:

    BCDMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    ZIG-ZAG

  • Width:

    4.5 mm

TDA75613LV Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TDA75613LV is 2.5W, but it can be limited by the thermal resistance of the package and the PCB. It's recommended to keep the junction temperature below 150°C to ensure reliable operation.
  • To minimize EMI, it's recommended to follow good PCB design practices such as keeping the power supply lines short and away from the output stage, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, using a shielded inductor and placing it away from the device can also help reduce EMI.
  • The recommended input capacitor value for the TDA75613LV is 10uF to 22uF, with a voltage rating of at least 25V. A larger capacitor value can help improve the power supply rejection ratio (PSRR) and reduce output voltage ripple.
  • The TDA75613LV is rated for operation up to 125°C, but it's recommended to derate the power dissipation at higher temperatures to ensure reliable operation. It's also important to consider the thermal resistance of the package and the PCB when operating at high temperatures.
  • The TDA75613LV has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, it's still recommended to add external protection circuitry such as a voltage supervisor or a crowbar circuit to protect the device from voltage transients and faults.

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TDA75613LV Overview

Use the download button to access the TDA75613LV schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA75, or try a keyword search, such as Audio/Video Amplifiers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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