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TDA7566 - STMicroelectronics

Description: Amplifier IC 4-Channel (Quad) Class AB 25-Flexiwatt (Vertical)60W x 4 @ 2Ohm 8V ~ 18V Through Hole -55°C ~ 150°C (TJ)

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TDA7566 - STMicroelectronics - PCB symbol
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PCB Footprints
TDA7566 - STMicroelectronics PCB footprint - Other - Other - Flexiwatt25 (vertical)
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3D Models
TDA7566 - STMicroelectronics - 3D model - Other - Flexiwatt25 (vertical)
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TDA7566 Details

  • Manufacturer Part Number:

    TDA7566

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ZFM

  • Package Description:

    ROHS COMPLIANT, FLEXIWATT-25

  • Pin Count:

    25

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-XZIP-T25

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Output Power-Nom:

    60 W

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZIP

  • Package Equivalence Code:

    ZIP25,.16,.16,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    NO

  • Technology:

    BCDMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    ZIG-ZAG

TDA7566 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TDA7566 is dependent on the package type and thermal conditions. For the DFN8 package, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the operating temperature and thermal resistance of the package.
  • To minimize EMI, it is recommended to follow good PCB layout practices such as keeping the power supply lines short and away from the output stage, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, the TDA7566 has a dedicated pin for EMI reduction, which should be connected to a capacitor to ground.
  • The recommended input capacitor value for the TDA7566 is 2.2uF to 4.7uF, depending on the input voltage and operating frequency. A larger capacitor value can help to improve the power supply rejection ratio (PSRR) and reduce output voltage ripple.
  • The TDA7566 is rated for operation up to 150°C junction temperature. However, the device's performance and reliability may be affected at high temperatures. It is recommended to derate the output current and power dissipation at high temperatures to ensure reliable operation.
  • The TDA7566 has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, additional external protection circuits may be required depending on the application. It is recommended to use a voltage supervisor or a reset IC to monitor the input voltage and reset the device in case of an overvoltage or undervoltage condition.

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TDA7566 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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