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TDA7851F - STMicroelectronics

Description: Amplifier IC 4-Channel (Quad) Class AB 25-Flexiwatt (Vertical)

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TDA7851F - STMicroelectronics PCB footprint - Other - Other - TDA7851F-1
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TDA7851F Details

  • Manufacturer Part Number:

    TDA7851F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    ZIP

  • Package Description:

    ROHS COMPLIANT, FLEXIWATT-25

  • Pin Count:

    25

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-XZIP-T25

  • JESD-609 Code:

    e3

  • Length:

    29.23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Output Power-Nom:

    48 W

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SZIP

  • Package Equivalence Code:

    ZIP25,.16,.16,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    19.37 mm

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    NO

  • Technology:

    BCDMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    ZIG-ZAG

  • Width:

    4.5 mm

TDA7851F Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA7851F involves keeping the analog and digital grounds separate, using a star-point grounding system, and placing the device close to the power supply. Additionally, using a 4-layer PCB with a dedicated ground plane can help reduce EMI.
  • To optimize power supply decoupling, use a combination of ceramic and electrolytic capacitors with different values (e.g., 100nF, 1uF, and 10uF) placed close to the device's power pins. This helps to filter out high-frequency noise and ensures stable operation.
  • To manage thermal dissipation, use a heat sink with a thermal conductivity of at least 1 W/m-K, and apply a thermal interface material (TIM) with a thermal conductivity of at least 5 W/m-K. Ensure good airflow around the device and avoid blocking the heat sink's airflow path.
  • To troubleshoot audio output issues, check the device's clock configuration, ensure proper power supply decoupling, and verify that the audio input signals are within the recommended voltage range. Also, check for any signs of overheating, and verify that the device is properly configured for the desired audio mode.
  • Key considerations for designing a robust and reliable system using the TDA7851F include ensuring proper power supply design, using adequate decoupling and filtering, selecting suitable components, and following recommended PCB layout and thermal management guidelines.

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TDA7851F Overview

Use the download button to access the TDA7851F schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA78, or try a keyword search, such as Audio/Video Amplifiers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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