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TDA8020HL/C2,118 - NXP

Description: NXP - TDA8020HL/C2,118 - SMART CARD INTERFACE, 6.5V, LQFP-32

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PCB Footprints
TDA8020HL/C2,118 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT358-1
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TDA8020HL/C2,118 - NXP  - 3D model - Quad Flat Packages - SOT358-1
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TDA8020HL/C2,118 Details

  • Manufacturer Part Number:

    TDA8020HL/C2,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-358-1, LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT358-1

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    6.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

TDA8020HL/C2,118 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8020HL/C2,118 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the antenna. Additionally, ensure that the PCB traces are short and direct, and that the decoupling capacitors are placed as close as possible to the device.
  • To ensure the TDA8020HL/C2,118 operates within the specified temperature range, ensure good thermal design and heat dissipation on the PCB. Use thermal vias, thermal pads, and a heat sink if necessary. Also, avoid blocking airflow around the device and ensure the device is not exposed to extreme temperatures during storage or operation.
  • When designing a power supply for the TDA8020HL/C2,118, critical components to consider include the voltage regulator, decoupling capacitors, and filter components. Ensure the power supply can provide a stable voltage within the recommended range, and that the decoupling capacitors are placed close to the device to minimize noise and ripple.
  • To troubleshoot issues with the TDA8020HL/C2,118, start by checking the power supply and ensuring it is within the recommended range. Verify that the device is properly configured and that the antenna is properly connected. Use a logic analyzer or oscilloscope to debug the digital signals, and check for any signs of overheating or physical damage to the device.
  • To ensure electromagnetic compatibility (EMC) with the TDA8020HL/C2,118, key considerations include using a metal shielded enclosure, keeping the device away from other RF sources, and using a common mode choke or ferrite bead to filter out electromagnetic interference (EMI). Additionally, ensure the PCB is designed with EMC in mind, using techniques such as grounding, shielding, and filtering.

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TDA8020HL/C2,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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