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TDA8026ET/C2,551 - NXP

Description: NXP - TDA8026ET/C2,551 - SMART CARD INTERFACE, 5.5V, TFBGA-84

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TDA8026ET/C2,551 - NXP - PCB symbol
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PCB Footprints
TDA8026ET/C2,551 - NXP PCB footprint - BGA - BGA - TFBGA64
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3D Models
TDA8026ET/C2,551 - NXP - 3D model - BGA - TFBGA64
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TDA8026ET/C2,551 Details

  • Manufacturer Part Number:

    TDA8026ET/C2,551

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    BGA

  • Package Description:

    TFBGA, BGA64,8X8,32

  • Pin Count:

    64

  • Manufacturer Package Code:

    SOT1073-1

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0.4

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PBGA-B64

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA64,8X8,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7 mm

TDA8026ET/C2,551 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8026ET/C2,551 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, ensure that the input and output tracks are well-separated to minimize crosstalk.
  • To ensure EMC compliance, follow the recommended PCB layout, use a metal shield or screen to enclose the device, and ensure that the device is properly grounded. Additionally, use filters or chokes to reduce electromagnetic radiation and susceptibility.
  • The TDA8026ET/C2,551 has an operating temperature range of -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Yes, the TDA8026ET/C2,551 is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • To troubleshoot issues with the TDA8026ET/C2,551, start by checking the power supply voltage, ensuring that it's within the recommended range. Then, verify that the input and output signals are within the specified limits. Use an oscilloscope to analyze the signal waveforms and identify any anomalies.

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TDA8026ET/C2,551 Overview

Use the download button to access the TDA8026ET/C2,551 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA80, or try a keyword search, such as Other Interface ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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