TDA8026ET/C2 - NXP

TDA8026ET/C2 Details

• Manufacturer Part Number:

  TDA8026ET/C2

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  TFBGA-64

• Pin Count:

  64

• Manufacturer Package Code:

  SOT1073-1

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Additional Feature:

  ALSO OPERATE FROM 5.25 TO 5.5 V SUPPLY

• Interface IC Type:

  INTERFACE CIRCUIT

• JESD-30 Code:

  S-PBGA-B64

• JESD-609 Code:

  e1

• Length:

  7 mm

• Moisture Sensitivity Level:

  2

• Number of Functions:

  1

• Number of Terminals:

  64

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -25 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA64,8X8,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.2 mm

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  2.7 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Temperature Grade:

  OTHER

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  7 mm