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TDA8034HN/C1,118 - NXP

Description: Interface - Specialized SMART CARD INTERFACE

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TDA8034HN/C1,118 - NXP - PCB symbol
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PCB Footprints
TDA8034HN/C1,118 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT616-1
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3D Models
TDA8034HN/C1,118 - NXP - 3D model - Quad Flat No-Lead - SOT616-1
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TDA8034HN/C1,118 Details

  • Manufacturer Part Number:

    TDA8034HN/C1,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, SOT616-1, MO-220, SOT616-1 HVQFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    SOT616-1

  • Country Of Origin:

    Mainland China, Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Additional Feature:

    IT ALSO REQURIES A 4.85V TO 5.5V SUPPLY

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQCC-N24

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

TDA8034HN/C1,118 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8034HN/C1,118 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure EMC with the TDA8034HN/C1,118, follow proper PCB design guidelines, use shielding, and implement filtering on the input and output lines. Additionally, ensure that the device is properly grounded and that the system is designed to meet the relevant EMC standards.
  • The TDA8034HN/C1,118 has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink. Additionally, ensure good airflow around the device and avoid blocking the airflow with other components.
  • The TDA8034HN/C1,118 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's power handling and to implement additional cooling measures to ensure reliable operation in high-temperature environments.
  • To troubleshoot issues with the TDA8034HN/C1,118, start by checking the power supply voltage, input and output signals, and the device's operating temperature. Use an oscilloscope to analyze the signals and look for signs of overheating, oscillation, or other anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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TDA8034HN/C1,118 Overview

Use the download button to access the TDA8034HN/C1,118 schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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