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TDA8541T/N1,112 - NXP

Description: Amplifier IC 1-Channel (Mono) Class AB 8-SO

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TDA8541T/N1,112 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO8
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TDA8541T/N1,112 - NXP  - 3D model - Small Outline Packages - SO8
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TDA8541T/N1,112 Details

  • Manufacturer Part Number:

    TDA8541T/N1,112

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    20 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    1.2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TDA8541T/N1,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8541T involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the TDA8541T operates within its recommended operating conditions, monitor the device's junction temperature, supply voltage, and output current. Implement thermal management techniques, such as heat sinks or thermal pads, to keep the junction temperature below 150°C. Also, ensure the supply voltage is within the recommended range of 4.5V to 5.5V, and the output current does not exceed 1A.
  • To minimize EMI and ensure EMC compliance, use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the output. Also, ensure the device is properly decoupled, and the power supply is filtered. Additionally, consider using a spread-spectrum clock generator to reduce EMI emissions.
  • To troubleshoot issues with the TDA8541T, start by verifying the PCB layout and component placement. Check for proper decoupling, and ensure the input and output capacitors are of sufficient value. Use an oscilloscope to monitor the output voltage and current, and check for signs of oscillation or instability. Also, verify the device is operating within its recommended operating conditions.
  • The TDA8541T has limited short-circuit protection, which means it may not be able to withstand continuous short-circuit conditions. To mitigate this, implement external short-circuit protection, such as a fuse or a current-limiting resistor, to prevent damage to the device and the system.

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TDA8541T/N1,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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