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TDA8547TS/N1,112 - NXP

Description: NXP - TDA8547TS/N1,112 - Audio Power Amplifier, 700 mW, AB, 2 Channel, 2.2V to 18V, SSOP, 20 Pins

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TDA8547TS/N1,112 - NXP PCB footprint - Other - Other -  SOT266-1
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TDA8547TS/N1,112 Details

  • Manufacturer Part Number:

    TDA8547TS/N1,112

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP2

  • Package Description:

    4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOT266-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    1.2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Current-Max:

    22 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

TDA8547TS/N1,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8547TS/N1,112 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure EMC with the TDA8547TS/N1,112, use a shielded enclosure, keep the device away from antennas and other RF sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, follow good PCB design practices, such as using a solid ground plane and minimizing loop areas.
  • The maximum power dissipation of the TDA8547TS/N1,112 is dependent on the operating conditions and package type. To ensure it doesn't overheat, use a heat sink or thermal pad, and ensure good airflow around the device. Also, follow the recommended operating conditions and thermal management guidelines in the datasheet.
  • The TDA8547TS/N1,112 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure the device is operated within the recommended temperature range, and consider using thermal management techniques, such as heat sinks or thermal pads, to maintain a safe operating temperature.
  • To troubleshoot issues with the TDA8547TS/N1,112, start by verifying the PCB layout and component values, and ensure the device is operated within the recommended conditions. Use oscilloscopes and spectrum analyzers to measure the device's output and identify any oscillations or instability. Consult the datasheet and application notes for guidance on troubleshooting and optimization techniques.

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TDA8547TS/N1,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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