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TDA8566Q/N2S,112 - NXP

Description: NXP - TDA8566Q/N2S,112 - Audio Power Amplifier, 40 W, B, 2 Channel, 6V to 18V, DBS, 17 Pins

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Symbol
TDA8566Q/N2S,112 - NXP - PCB symbol
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PCB Footprints
TDA8566Q/N2S,112 - NXP PCB footprint - Other - Other - SOT243-1
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3D Models
TDA8566Q/N2S,112 - NXP - 3D model - Other - SOT243-1
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TDA8566Q/N2S,112 Details

  • Manufacturer Part Number:

    TDA8566Q/N2S,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ZIP

  • Package Description:

    PLASTIC, SOT-243-1, DIL-BENT-SIL, 17 PIN

  • Pin Count:

    17

  • Manufacturer Package Code:

    SOT243-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    26 dB

  • Harmonic Distortion:

    30%

  • JESD-30 Code:

    R-PZFM-T17

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    17

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    55 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    ZFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    ZIG-ZAG

TDA8566Q/N2S,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8566Q/N2S,112 involves keeping the analog and digital grounds separate, using a star-point grounding system, and placing the decoupling capacitors close to the IC. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To optimize thermal performance, ensure good airflow around the IC, use a heat sink if possible, and avoid blocking the airflow around the IC. Also, ensure that the PCB is designed to dissipate heat efficiently, and consider using thermal vias to dissipate heat from the top layer to the bottom layer.
  • The TDA8566Q/N2S,112 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions when handling the IC. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes and resistors.
  • To troubleshoot issues with the TDA8566Q/N2S,112, start by checking the power supply voltage and ensuring that it's within the recommended range. Check the input and output signals using an oscilloscope, and verify that the IC is properly configured. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • To test and measure the performance of the TDA8566Q/N2S,112, use a signal generator to provide a test signal, and measure the output using an oscilloscope or a spectrum analyzer. Consult the datasheet and application notes for specific test and measurement procedures, and consider using a test fixture or a development board to simplify the testing process.

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TDA8566Q/N2S,112 Overview

Use the download button to access the TDA8566Q/N2S,112 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA85, or try a keyword search, such as Audio/Video Amplifiers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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