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TDA8571J/N2S,112 - NXP

Description: Amplifier IC 4-Channel (Quad) Class B DBS23P 45W

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TDA8571J/N2S,112 - NXP PCB footprint - Other - Other - TDA8571J/N2S,112-6
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TDA8571J/N2S,112 - NXP  - 3D model - Other - TDA8571J/N2S,112-6
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TDA8571J/N2S,112 Details

  • Manufacturer Part Number:

    TDA8571J/N2S,112

  • Brand Name:

    NXP Semiconductor

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ZIP

  • Package Description:

    PLASTIC, DIL-BENT-SIL, 23 PIN

  • Pin Count:

    23

  • Manufacturer Package Code:

    SOT411-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    34 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PSIP-T23

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    23

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    26 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    ZIG-ZAG

TDA8571J/N2S,112 Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the TDA8571J/N2S,112. Ensure that the input and output stages are separated, and the power supply lines are decoupled. Use a star-ground configuration and keep the signal paths as short as possible. NXP provides a recommended PCB layout in the application note AN10365.
  • The choice of external components, such as resistors, capacitors, and inductors, depends on the specific application and desired performance. Refer to the datasheet and application notes for guidance on component selection. NXP also provides a component calculator tool to help with component selection.
  • The maximum power dissipation of the TDA8571J/N2S,112 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4 W at 25°C. However, it's essential to perform thermal calculations and consider heat sinking to ensure reliable operation.
  • The TDA8571J/N2S,112 is rated for operation up to 150°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and ensure that the device operates within the recommended temperature range.
  • Common issues with the TDA8571J/N2S,112 can be troubleshooted by checking the PCB layout, component values, and power supply quality. Ensure that the input and output stages are properly decoupled, and the power supply is stable. Use oscilloscopes and spectrum analyzers to identify and diagnose issues. NXP also provides application notes and technical support to help with troubleshooting.

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TDA8571J/N2S,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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