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TDA8925J/N1,112 - NXP

Description: Power stage 2 x 15 to 25 W class-D audio amplifier, plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm), SOT243-3

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TDA8925J/N1,112 - NXP PCB footprint - Other - Other - DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
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TDA8925J/N1,112 - NXP  - 3D model - Other - DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
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TDA8925J/N1,112 Details

  • Manufacturer Part Number:

    TDA8925J/N1,112

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ZFM

  • Package Description:

    PLASTIC, SOT-243-3, DIL-BENT-SIL, 17 PIN

  • Pin Count:

    17

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PZFM-T17

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    17

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    20 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    ZFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    7.5 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    ZIG-ZAG

TDA8925J/N1,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the TDA8925J/N1,112 near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. The datasheet provides some guidelines, but NXP also offers a dedicated application note (AN11535) that provides more detailed recommendations.
  • To ensure EMC with the TDA8925J/N1,112, follow proper PCB design and layout practices, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering components as needed. NXP also provides an application note (AN11023) that offers more detailed EMC design guidelines.
  • The recommended power-up sequence for the TDA8925J/N1,112 is to first apply the analog supply voltage (VCC) and then the digital supply voltage (VDD). This ensures that the internal voltage regulators are properly initialized. A detailed power-up sequence is provided in the datasheet.
  • To troubleshoot common issues with the TDA8925J/N1,112, start by checking the PCB layout and thermal design to ensure good heat dissipation. Also, verify that the input and output signals are within the recommended specifications, and check for any signs of oscillation or instability. NXP also offers a troubleshooting guide (AN11536) that provides more detailed guidance.
  • Yes, the TDA8925J/N1,112 requires proper input and output filtering to ensure stable operation and minimize electromagnetic interference (EMI). The datasheet provides some guidelines, but NXP also offers a dedicated application note (AN11534) that provides more detailed recommendations for filter design and component selection.

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TDA8925J/N1,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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