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TDA8932BT/N2,112 - NXP

Description: Audio Amp Speaker 1-CH Mono/2-CH Stereo 55W Class-D 32-Pin SO Bulk

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TDA8932BT/N2,112 - NXP - PCB symbol
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PCB Footprints
TDA8932BT/N2,112 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT287-1
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TDA8932BT/N2,112 - NXP - 3D model - Small Outline Packages - SOT287-1
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TDA8932BT/N2,112 Details

  • Manufacturer Part Number:

    TDA8932BT/N2,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOP

  • Package Description:

    7.50 MM , PLASTIC, MO-119, SOT-287-1, SOP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT287-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 10V TO 36V SINGLE SUPPLY

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Length:

    20.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    55 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

TDA8932BT/N2,112 Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. Keep the device away from heat sources and ensure good airflow. Refer to NXP's application note AN11542 for more information.
  • Use the output filter design tool provided by NXP or follow the guidelines in the datasheet. Ensure the filter components are selected based on the output power, frequency, and load impedance. A 2nd-order LC filter is recommended for most applications.
  • Follow the guidelines in the datasheet and application notes for PCB layout, component selection, and shielding. Ensure proper grounding, decoupling, and filtering to minimize EMI. Conduct EMC testing to ensure compliance with relevant standards.
  • Check the PCB layout, thermal design, and component selection. Verify the input and output impedance matching, and ensure proper decoupling and filtering. Use oscilloscopes and spectrum analyzers to diagnose issues. Refer to NXP's application notes and technical support for guidance.
  • Use a signal generator, oscilloscope, and spectrum analyzer to measure parameters like gain, frequency response, and distortion. Follow the test procedures outlined in the datasheet and application notes. Ensure proper calibration and setup of test equipment.

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TDA8932BT/N2,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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