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TDE1708DFT - STMicroelectronics

Description: Power Switch ICs - Power Distribution Intell. power switch

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TDE1708DFT - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN (4x4)
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TDE1708DFT - STMicroelectronics  - 3D model - Small Outline No-lead - DFN (4x4)
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TDE1708DFT Details

  • Manufacturer Part Number:

    TDE1708DFT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    4 X 4 MM, ROHS COMPLIANT, DFN-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Built-in Protections:

    TRANSIENT; THERMAL

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-XDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    0.3 A

  • Output Peak Current Limit-Nom:

    0.25 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.15,32

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    48 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

TDE1708DFT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management.
  • To optimize thermal performance, ensure good thermal coupling between the device and the PCB, use a thermal pad or heat sink, and follow the recommended PCB layout guidelines. Additionally, reduce the thermal resistance by using thermal vias and thermal layers in the PCB.
  • The maximum allowed voltage on the VCC pin is 5.5V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Follow the recommended power-up and power-down sequences outlined in the datasheet to ensure proper device operation and prevent damage. Typically, this involves powering up the VCC pin before the VIN pin, and powering down the VIN pin before the VCC pin.
  • The TDE1708DFT has built-in ESD protection, but it's still recommended to follow proper ESD handling and storage procedures to prevent damage. Use ESD-safe materials, handle the device by the body, and avoid touching the pins.

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TDE1708DFT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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