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TDF8599ATH/N2CS - NXP

Description: Audio Amplifiers I2C-bus controlled dual channel 135W/4 Ohm, single channel 250W/2 Ohm class-D power amplifier with load diagnostics

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TDF8599ATH/N2CS - NXP PCB footprint - Other - Other - SOT851-2_2025
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TDF8599ATH/N2CS Details

  • Manufacturer Part Number:

    TDF8599ATH/N2CS

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SO-851-2, HSOP-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    SOT851-2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    26 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PDSO-G36

  • Length:

    15.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    135 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max (Vsup):

    35 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

TDF8599ATH/N2CS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a shielded enclosure, ensure proper grounding, and follow good PCB design practices. Additionally, use a common mode choke and a ferrite bead on the power lines to reduce EMI.
  • Power up the device in the following sequence: VDD, AVDD, and then DVDD. Ensure that the power supplies are stable before applying the clock signal.
  • Use the power-down modes (e.g., standby, sleep) when the device is not in use. Optimize the clock frequency and voltage settings for the specific application. Use a low-dropout regulator (LDO) to reduce power consumption.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device, and avoid blocking the airflow. Use thermal interface material (TIM) to improve heat transfer.

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TDF8599ATH/N2CS Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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For a full list of alternate parts for TDF8599ATH/N2CS, check out Findchips.com