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TDF8599BTH/N1CS - NXP

Description: Amplifier IC 1-Channel (Mono) or 2-Channel (Stereo) Class D 36-HSOP

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TDF8599BTH/N1CS - NXP PCB footprint - Small Outline Packages - Small Outline Packages - HSOP36
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TDF8599BTH/N1CS - NXP  - 3D model - Small Outline Packages - HSOP36
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TDF8599BTH/N1CS Details

  • Manufacturer Part Number:

    TDF8599BTH/N1CS

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SOT851-2, HSOP-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    SOT851-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Harmonic Distortion:

    1%

  • JESD-30 Code:

    R-PDSO-G36

  • Length:

    15.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    150 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.56

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max (Vsup):

    24 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

TDF8599BTH/N1CS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance matching to minimize signal reflections.
  • Use a thermal pad or thermal interface material to improve heat dissipation. Ensure good airflow around the device and avoid blocking the thermal pads. Operate the device within the specified temperature range of -40°C to 125°C.
  • The recommended input impedance is 50 ohms. Ensure that the input signal is matched to 50 ohms to minimize signal reflections and ensure optimal performance.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals. Check the power supply voltage, input signal quality, and PCB layout for any issues. Consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, the TDF8599BTH/N1CS can be used in non-automotive applications, but ensure that the operating conditions and specifications meet the requirements of the target application.

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TDF8599BTH/N1CS Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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