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TEA1507P/N1,112 - NXP

Description: IC CTRLR SMPS GREEN CM OVP 8DIP

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TEA1507P/N1,112 - NXP PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - TDA1543 Dual 16-bit DAC (economy version) (I2S input format)
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3D Models
TEA1507P/N1,112 - NXP  - 3D model - Dual-In-Line Packages - TDA1543 Dual 16-bit DAC (economy version) (I2S input format)
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TEA1507P/N1,112 Details

  • Manufacturer Part Number:

    TEA1507P/N1,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT97-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Min:

    7 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.2 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    205 kHz

  • Technology:

    BCDMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.62 mm

TEA1507P/N1,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TEA1507P/N1,112 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the TEA1507P/N1,112 operates within its SOA, implement a soft-start circuit to limit the inrush current during startup. During shutdown, use a controlled shutdown sequence to prevent voltage spikes and ensure a gradual decrease in output voltage.
  • For thermal management, ensure good airflow around the device, use a heat sink with a thermal resistance of <1°C/W, and apply a thermal interface material (TIM) with a thermal conductivity of >5 W/mK. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • To troubleshoot issues, start by verifying the input voltage, output voltage, and current. Check for proper PCB layout, decoupling, and thermal management. Use an oscilloscope to analyze the output voltage and current waveforms. Consult the datasheet and application notes for guidance on specific troubleshooting steps.
  • For the TEA1507P/N1,112, use input capacitors with a capacitance of 10-22 μF, a voltage rating of 25-50 V, and an ESR of <1 Ω. For output capacitors, use a capacitance of 10-47 μF, a voltage rating of 10-25 V, and an ESR of <1 Ω. Choose capacitors with a low ESR and a high ripple current rating.

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TEA1507P/N1,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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