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TEA1833TS/1H - NXP

Description: AC/DC Converters GreenChip SMPS Control IC

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Symbol
TEA1833TS/1H - NXP - PCB symbol
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PCB Footprints
TEA1833TS/1H - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - (TSOP6); 6 lead
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3D Models
TEA1833TS/1H - NXP - 3D model - SOT23 (6-Pin) - (TSOP6); 6 lead
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TEA1833TS/1H Details

  • Manufacturer Part Number:

    TEA1833TS/1H

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP

  • Package Description:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT457

  • Country Of Origin:

    Malaysia, Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    10.5 V

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    400 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    142 kHz

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

TEA1833TS/1H Frequently Asked Questions (FAQs)

  • A good PCB layout for the TEA1833TS/1H involves keeping the input and output stages separate, using a star-ground configuration, and minimizing the length of the power traces. A 4-layer PCB with a dedicated ground plane is recommended.
  • The TEA1833TS/1H has a thermal pad on the bottom of the package. Ensure good thermal contact between the thermal pad and a heat sink or a metal plate on the PCB. Apply a thin layer of thermal interface material (TIM) to improve heat transfer.
  • The maximum allowed voltage on the VCC pin is 18V. Exceeding this voltage may damage the device. Ensure that the voltage regulator or power supply provides a stable voltage within the recommended range.
  • Use an oscilloscope to monitor the input and output voltages, as well as the current consumption. Check for signs of overheating, such as excessive temperature rise or thermal shutdown. Verify that the input voltage and current are within the recommended specifications.
  • Yes, the TEA1833TS/1H is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is suitable for use in harsh environments.

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TEA1833TS/1H Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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