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TEA18361T/1J - NXP

Description: Switching Controllers GreenChip SMPS contr control IC

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TEA18361T/1J - NXP - PCB symbol
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TEA18361T/1J - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TEA18361T/1J
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TEA18361T/1J Details

  • Manufacturer Part Number:

    TEA18361T/1J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOT108-1

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.7 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    140 kHz

  • Technology:

    SOI-CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TEA18361T/1J Frequently Asked Questions (FAQs)

  • A good PCB layout for the TEA18361T/1J involves keeping the input and output stages separate, using a star-ground configuration, and minimizing the length of the power traces. A 4-layer PCB with a dedicated ground plane is recommended.
  • The TEA18361T/1J has a thermal pad on the bottom of the package, which should be connected to a heat sink or a thermal via to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for the input stage. The capacitor should be placed as close to the IC as possible and have a low ESR (Equivalent Series Resistance) to minimize voltage ripple.
  • The output voltage of the TEA18361T/1J can be configured by adjusting the feedback resistors (RFBT and RFB) and the voltage reference (VREF) pin. The datasheet provides a formula to calculate the required resistor values for a specific output voltage.
  • The TEA18361T/1J has a maximum output current capability of 3.5A. However, the actual output current capability may be limited by the input voltage, output voltage, and thermal considerations.

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TEA18361T/1J Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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