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TEA18363T/1J - NXP

Description: NXP - TEA18363T/1J - AC-DC CONV, FLYBACK, SOIC-8

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TEA18363T/1J - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TEA18363T/1J
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TEA18363T/1J Details

  • Manufacturer Part Number:

    TEA18363T/1J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Additional Feature:

    ESD for All other pins except HV is 2

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.7 mA

  • Supply Voltage-Nom (Vsup):

    20 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    140 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TEA18363T/1J Frequently Asked Questions (FAQs)

  • A good PCB layout for the TEA18363T/1J involves keeping the input and output stages separate, using a star-ground configuration, and minimizing the length of the power traces. A 4-layer PCB with a dedicated ground plane is recommended.
  • The TEA18363T/1J has a thermal pad on the bottom of the package. Ensure good thermal contact between the thermal pad and a heat sink or a metal plate on the PCB. Apply a thin layer of thermal interface material (TIM) to improve heat transfer.
  • The maximum allowed voltage on the VCC pin of the TEA18363T/1J is 18V. Exceeding this voltage may damage the device.
  • Use an oscilloscope to monitor the input and output voltages, and check for any signs of oscillation or instability. Verify that the device is properly cooled and that the PCB layout is correct. Consult the datasheet and application notes for troubleshooting guidelines.
  • No, the TEA18363T/1J is not designed to deliver output currents higher than 3.5A. Exceeding this current may cause the device to overheat or fail. Consider using a different device or paralleling multiple TEA18363T/1J devices to achieve higher output currents.

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TEA18363T/1J Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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