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TEA19162T/2J - NXP

Description: Power Factor Correction - PFC PFC controller

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Symbol
TEA19162T/2J - NXP - PCB symbol
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PCB Footprints
TEA19162T/2J - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO8: plastic small outline package; 8 leads; body width 3.9 mm
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3D Models
TEA19162T/2J - NXP - 3D model - Small Outline Packages - SO8: plastic small outline package; 8 leads; body width 3.9 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for TEA19162T/2J
  • Part Number TEA19162T/2J
  • Manufacturer NXP
  • Pin Count 8
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - SO8: plastic small outline package; 8 leads; body width 3.9 mm
  • Released Date Nov 25, 2023
  • Last Modified Date Nov 25, 2023 6:25 AM UTC
  • Pinout / Pin List Click Here (Member Only)

TEA19162T/2J Details

  • Manufacturer Part Number:

    TEA19162T/2J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    148 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TEA19162T/2J Frequently Asked Questions (FAQs)

  • A good PCB layout for the TEA19162T/2J should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper coverage around the device. Avoid routing high-frequency signals near the device to minimize electromagnetic interference.
  • To ensure reliable operation, follow the recommended operating conditions, and consider the device's thermal characteristics. Implement thermal management techniques, such as heat sinks or thermal pads, and ensure good airflow around the device. Additionally, consider using thermal simulation tools to optimize your design.
  • For EMI and EMC compliance, ensure proper PCB layout, decoupling, and filtering. Use shielding, grounding, and filtering techniques to minimize electromagnetic radiation. Follow NXP's application notes and guidelines for EMI and EMC compliance, and consult relevant industry standards.
  • To troubleshoot issues with the internal voltage regulator, check the input voltage, output voltage, and current consumption. Verify that the device is properly configured and that the input voltage is within the recommended range. Consult the datasheet and application notes for troubleshooting guidelines and consider using a voltage regulator-specific debugging tool.
  • For testing and measurement, use a combination of oscilloscopes, signal generators, and multimeters. Ensure proper probing and measurement techniques to avoid loading or damaging the device. Consult the datasheet and application notes for specific testing and measurement guidelines.

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TEA19162T/2J Overview

Use the download button to access the TEA19162T/2J schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TEA19, or try a keyword search, such as Switching Regulator or Controllers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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