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TEA2095TE/1/S30 - NXP

Description: GreenChip dual synchronous rectifier controller

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PCB Footprints
TEA2095TE/1/S30 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT786-3
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3D Models
TEA2095TE/1/S30 - NXP  - 3D model - Small Outline Packages - SOT786-3
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TEA2095TE/1/S30 Details

  • Manufacturer Part Number:

    TEA2095TE/1/S30

  • Part Life Cycle Code:

    Active

  • Package Description:

    HSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    NXP Semiconductors

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max (Isup):

    1.05 mA

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    SOI-CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

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TEA2095TE/1/S30 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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