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TEA5711 - NXP

Description: AM/FM stereo radio circuit, DIP

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PCB Footprints
TEA5711 - NXP PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 4 Plastic shrink dual in-line package; 32 leads (400 mil); (SDIP32; SOT232-1).
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3D Models
TEA5711 - NXP  - 3D model - Dual-In-Line Packages - 4 Plastic shrink dual in-line package; 32 leads (400 mil); (SDIP32; SOT232-1).
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for TEA5711
  • Part Number TEA5711
  • Manufacturer NXP
  • Pin Count 32
  • Part Category Integrated Circuit
  • Package Category Dual-In-Line Packages
  • Footprint Name Dual-In-Line Packages - 4 Plastic shrink dual in-line package; 32 leads (400 mil); (SDIP32; SOT232-1).
  • Released Date Feb 18, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

TEA5711 Details

  • Manufacturer Part Number:

    TEA5711

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.400 INCH, PLASTIC, SOT-232, SDIP-32

  • Pin Count:

    32

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Consumer IC Type:

    AUDIO SINGLE CHIP RECEIVER

  • Demodulation Type:

    AM/FM

  • Harmonic Distortion:

    0.8%

  • JESD-30 Code:

    R-PDIP-T32

  • JESD-609 Code:

    e3

  • Length:

    28.95 mm

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    60 °C

  • Operating Temperature-Min:

    -15 °C

  • Output Voltage-Nom (AM):

    45 mV

  • Output Voltage-Nom (FM):

    61 mV

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SDIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.7 mm

  • Signal to Noise Ratio-Nom (FM):

    61 dB

  • Supply Current-Max:

    20.2 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Surface Mount:

    NO

  • Technology:

    BIMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.778 mm

  • Terminal Position:

    DUAL

  • Width:

    10.16 mm

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TEA5711 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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