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TEA6320 - NXP

Description: • Source selector for four stereo and one mono inputs • Interface for noise reduction circuits • Interface for external equalizer • Volume, balance and fader control • Special loudness characteristic automatically controlled in combination with volume setting • Bass and treble control • Mute control at audio signal zero crossing • Fast mute control via I2C-bus • Fast mute control via pin • I 2C-bus control for all functions • Power supply with internal power-on reset

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PCB Footprints
TEA6320 - NXP PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 4 Plastic shrink dual in-line package; 32 leads (400 mil); (SDIP32; SOT232-1).
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3D Models
TEA6320 - NXP  - 3D model - Dual-In-Line Packages - 4 Plastic shrink dual in-line package; 32 leads (400 mil); (SDIP32; SOT232-1).
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for TEA6320
  • Part Number TEA6320
  • Manufacturer NXP
  • Pin Count 32
  • Part Category Integrated Circuit
  • Package Category Dual-In-Line Packages
  • Footprint Name Dual-In-Line Packages - 4 Plastic shrink dual in-line package; 32 leads (400 mil); (SDIP32; SOT232-1).
  • Released Date Apr 25, 2023
  • Last Modified Date Apr 25, 2023 9:50 AM UTC
  • Pinout / Pin List Click Here (Member Only)

TEA6320 Details

  • Manufacturer Part Number:

    TEA6320

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DIP-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Channel Separation:

    96 dB

  • Consumer IC Type:

    SOUND FADER CONTROL CIRCUIT

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    R-PDIP-T32

  • Length:

    28.95 mm

  • Number of Bands:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SDIP

  • Package Equivalence Code:

    DIP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.7 mm

  • Supply Current-Max:

    33 mA

  • Supply Voltage-Max (Vsup):

    9.5 V

  • Supply Voltage-Min (Vsup):

    7.5 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.778 mm

  • Terminal Position:

    DUAL

  • Width:

    10.16 mm

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TEA6320 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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