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TEMD5010X01 - Vishay

Description: Vishay, TEMD5010X01 IR + Visible Light Si Photodiode, 65 °, Surface Mount

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TEMD5010X01 Details

  • Manufacturer Part Number:

    TEMD5010X01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5 X 4.24 MM, 1.12 MM HEIGHT, GREEN, MINIATURE, SMD, 4 PIN

  • Country Of Origin:

    Germany

  • HTS Code:

    8541.40.60.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    AEC-Q101, HIGH SENSITIVITY

  • Configuration:

    SINGLE

  • Dark Current-Max:

    30 nA

  • Infrared Range:

    YES

  • JESD-609 Code:

    e3

  • Light Current-Nom:

    0.05 mA

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    PIN PHOTODIODE

  • Packing Method:

    TR, 7 INCH

  • Peak Wavelength:

    940 nm

  • Reverse Breakdown Voltage-Min:

    60 V

  • Reverse Voltage-Max:

    60 V

  • Semiconductor Material:

    Silicon

  • Shape:

    RECTANGULAR

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

TEMD5010X01 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat effectively. A minimum of 2oz copper thickness is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the thermal pad. Use a soldering technique that minimizes the time the iron is in contact with the device.
  • The maximum power dissipation for the TEMD5010X01 is 1.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the device.
  • Yes, the TEMD5010X01 is qualified to AEC-Q101, which makes it suitable for high-reliability applications such as automotive systems.
  • To prevent damage, store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads.

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TEMD5010X01 Overview

Use the download button to access the TEMD5010X01 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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