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TFA9843J/N1,112 - NXP

Description: Amplifier IC 1-Channel (Mono) or 2-Channel (Stereo) Class AB 9-DBSP

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PCB Footprints
TFA9843J/N1,112 - NXP PCB footprint - Other - Other - SOT523-1
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TFA9843J/N1,112 - NXP  - 3D model - Other - SOT523-1
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TFA9843J/N1,112 Details

  • Manufacturer Part Number:

    TFA9843J/N1,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ZFM

  • Package Description:

    POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN

  • Pin Count:

    9

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    26 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PZIP-T9

  • JESD-609 Code:

    e3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    14 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    ZIP

  • Package Equivalence Code:

    ZIP9,.2,.11TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    ZIG-ZAG

TFA9843J/N1,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the TFA9843J/N1,112 near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal via array can help to dissipate heat efficiently.
  • To ensure EMC, it is recommended to use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead to filter out electromagnetic interference (EMI). Additionally, ensure that the PCB layout is designed to minimize radiation and susceptibility to EMI.
  • The recommended power-up sequence is to first apply the analog power supply (VCC) and then the digital power supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, which helps to prevent unwanted oscillations and ensures proper device operation.
  • To troubleshoot issues with the TFA9843J/N1,112, start by checking the power supply voltages, clock signals, and data lines. Use an oscilloscope to verify the signal waveforms and ensure that they are within the specified limits. Check the device's operating temperature and ensure that it is within the recommended range. If the issue persists, consult the datasheet and application notes for further guidance.
  • The maximum allowed power dissipation for the TFA9843J/N1,112 is dependent on the operating temperature and the thermal resistance of the device. According to the datasheet, the maximum power dissipation is 2.5 W at a junction temperature of 150°C. However, it is recommended to keep the power dissipation below 1.5 W to ensure reliable operation and to prevent overheating.

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TFA9843J/N1,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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