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TFDU4101-TT3 - Vishay

Description: TFDU4101-TT3 Vishay, IR Transceiver, 900nm 115.2kbit/s, 1m Range, SMT, 9.7 x 4.7 x 4mm

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TFDU4101-TT3 - Vishay PCB footprint - Other - Other - TFDU4101-TR3
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3D Models
TFDU4101-TT3 - Vishay  - 3D model - Other - TFDU4101-TR3
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TFDU4101-TT3 Details

  • Manufacturer Part Number:

    TFDU4101-TT3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODULE-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8517.62.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-XSMA-X8

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    2.4 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    UNSPECIFIED

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    4.7 mm

TFDU4101-TT3 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat effectively. A minimum of 2oz copper thickness is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the pads and use a reflow oven or a hot air gun to solder the device. Avoid overheating the device.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device.
  • Handle the device by the body or the anti-static foam tray to prevent ESD damage. Use an anti-static wrist strap or mat when handling the device. Store the device in an anti-static bag when not in use.
  • The recommended operating temperature range for the TFDU4101-TT3 is -40°C to 125°C. Operating the device outside this range may affect its performance and reliability.

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TFDU4101-TT3 Overview

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