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TFDU6300-TR1 - Vishay

Description: TFDU6300-TR1 Vishay, IR Transceiver, 900Nm 115.2kbit/s, 1m Range, SMT, 8.5 x 3.1 x 2.5mm

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Symbol
TFDU6300-TR1 - Vishay - PCB symbol
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PCB Footprints
TFDU6300-TR1 - Vishay PCB footprint - Other - Other - TFDU6300-TR1-3
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3D Models
TFDU6300-TR1 - Vishay - 3D model - Other - TFDU6300-TR1-3
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TFDU6300-TR1 Details

  • Manufacturer Part Number:

    TFDU6300-TR1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    8.50 X 2.50 MM, 3.10 MM HEIGHT, ROHS COMPLIANT, MODULE, 8 PIN

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-XSMA-L8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    2.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    L BEND

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

TFDU6300-TR1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the TFDU6300-TR1 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a solder mask defined (SMD) pad shape.
  • The TFDU6300-TR1 has a high power density, so thermal management is crucial. Ensure good airflow around the component, and consider using a heat sink or thermal interface material to reduce thermal resistance. The maximum junction temperature is 150°C.
  • The recommended soldering profile for the TFDU6300-TR1 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, the TFDU6300-TR1 is suitable for high-reliability applications. It is built with a robust design and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design, manufacturing, and testing procedures to ensure the component's reliability.
  • The TFDU6300-TR1 requires a bias voltage of 5V to 15V, with a recommended operating voltage of 12V. Ensure the bias voltage is stable and within the recommended range to ensure proper operation.

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TFDU6300-TR1 Overview

Use the download button to access the TFDU6300-TR1 schematic symbol, PCB footprint, and 3D model.
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