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TFM252012ALVA1R5MTAA - TDK

Description: TDK - TFM252012ALVA1R5MTAA - Thin Film Inductor, AEC-Q200, 1.5 µH, 0.06 ohm, 3.3 A, 2.5mm x 2mm x 1.2mm, TFM-ALVA Series

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PCB Footprints
TFM252012ALVA1R5MTAA - TDK PCB footprint - Inductors Chip - Inductors Chip - TFM252012ALMAR33MTAA
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3D Models
TFM252012ALVA1R5MTAA - TDK  - 3D model - Inductors Chip - TFM252012ALMAR33MTAA
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TFM252012ALVA1R5MTAA Details

  • Manufacturer Part Number:

    TFM252012ALVA1R5MTAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.06 Ω

  • Inductance-Nom (L):

    1.5 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Blister Plastic, 7 Inch

  • Rated Current-Max:

    3.1 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TFM252012ALVA1R5MTAA Frequently Asked Questions (FAQs)

  • The recommended land pattern for TFM252012ALVA1R5MTAA can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout, size, and spacing for optimal performance and reliability.
  • Thermal management is critical for TFM252012ALVA1R5MTAA. Ensure good thermal conductivity by using a thermal pad or thermal interface material (TIM) between the component and the PCB. Also, consider using a heat sink or thermal vias to dissipate heat efficiently. Refer to the datasheet for the recommended thermal resistance and junction temperature.
  • The maximum operating temperature range for TFM252012ALVA1R5MTAA is typically specified in the datasheet as -40°C to +125°C. However, it's essential to check the specific temperature rating for the particular component and application, as some components may have different temperature ranges or derating requirements.
  • To ensure the reliability and longevity of TFM252012ALVA1R5MTAA, follow proper storage and handling procedures, avoid excessive mechanical stress, and operate the component within the recommended specifications. Also, consider implementing a robust design, using a suitable PCB material, and ensuring good soldering quality.
  • While TFM252012ALVA1R5MTAA is designed to be robust, it's essential to evaluate its suitability for high-vibration or high-shock environments. Check the component's vibration and shock ratings, and consider implementing additional mechanical support or damping mechanisms to ensure reliability and performance.

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TFM252012ALVA1R5MTAA Overview

Use the download button to access the TFM252012ALVA1R5MTAA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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General Purpose Inductor, 1.5uH, 20%, 1 Element, Metal-Core, SMD, 1008