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TFM322512ALMA1R0MTAA - TDK

Description: SMD / SMT Inductors (Coils), L=1.0?H, L x W x T :

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TFM322512ALMA1R0MTAA - TDK PCB footprint - Inductors Chip - Inductors Chip - TFM322512ALMA1R0MTAA
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TFM322512ALMA1R0MTAA - TDK  - 3D model - Inductors Chip - TFM322512ALMA1R0MTAA
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TFM322512ALMA1R0MTAA Details

  • Manufacturer Part Number:

    TFM322512ALMA1R0MTAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.037 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    4 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TFM322512ALMA1R0MTAA Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TFM322512ALMA1R0MTAA can be found in the TDK Corporation's application note or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, it is recommended to handle the TFM322512ALMA1R0MTAA by the edges, avoid touching the pins, and use an anti-static wrist strap or mat to prevent electrostatic discharge. It is also recommended to follow the JEDEC standard for handling and storage of moisture-sensitive devices.
  • The thermal management strategy for the TFM322512ALMA1R0MTAA involves providing a thermal path from the device to a heat sink or a metal core PCB. The device's thermal pad should be connected to a copper plane or a thermal via to dissipate heat efficiently.
  • The TFM322512ALMA1R0MTAA is designed to withstand certain levels of vibration, but it is essential to evaluate the device's performance in the specific vibration environment. TDK Corporation provides vibration testing data, and it is recommended to consult with their application engineers for specific guidance.
  • To troubleshoot issues with the TFM322512ALMA1R0MTAA, it is recommended to follow a systematic approach, checking the power supply, clock signals, and data lines. Consult the datasheet and application notes for troubleshooting guidelines, and contact TDK Corporation's technical support for further assistance.

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TFM322512ALMA1R0MTAA Overview

Use the download button to access the TFM322512ALMA1R0MTAA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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