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TFM322512ALVA1R5MTAA - TDK

Description: Fixed Inductors 40VDC 1.5uH 20% 4A 57mOhm AEC-Q200

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PCB Footprints
TFM322512ALVA1R5MTAA - TDK PCB footprint - Inductors Chip - Inductors Chip - TFM3225_2021-4
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3D Models
TFM322512ALVA1R5MTAA - TDK  - 3D model - Inductors Chip - TFM3225_2021-4
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TFM322512ALVA1R5MTAA Details

  • Manufacturer Part Number:

    TFM322512ALVA1R5MTAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.057 Ω

  • Inductance-Nom (L):

    1.5 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    3.2 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TFM322512ALVA1R5MTAA Frequently Asked Questions (FAQs)

  • The recommended land pattern for TFM322512ALVA1R5MTAA can be found in the TDK Corporation's application note 'Recommended Land Pattern for TFM Series' (document number: TDK_EPCOS_TFM_Land_Pattern_AN). It provides detailed information on the recommended pad layout, solder mask, and solder paste requirements.
  • Thermal management is critical for the reliable operation of TFM322512ALVA1R5MTAA. It is recommended to use a thermal pad or a heat sink to dissipate heat generated by the device. The thermal pad should be connected to a copper plane on the PCB to ensure efficient heat dissipation. Additionally, ensure that the PCB design allows for good airflow around the device.
  • The maximum operating temperature range for TFM322512ALVA1R5MTAA is -40°C to +125°C. However, it is recommended to operate the device within the recommended operating temperature range of -20°C to +85°C for optimal performance and reliability.
  • Yes, TFM322512ALVA1R5MTAA is designed to withstand high-vibration environments. However, it is recommended to follow the recommended mounting and soldering procedures to ensure the device is securely attached to the PCB. Additionally, it is recommended to perform vibration testing to ensure the device meets the required specifications.
  • The recommended storage condition for TFM322512ALVA1R5MTAA is in a dry, cool place with a temperature range of -20°C to +40°C and humidity below 60%. It is recommended to store the devices in their original packaging or in a sealed bag to prevent moisture absorption.

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TFM322512ALVA1R5MTAA Overview

Use the download button to access the TFM322512ALVA1R5MTAA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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